Material Processing
Electron beam (EB) lithography system
Focused ion beam (FIB) system
Electron cyclotron resonance (ECR) plasma etching system
Mask aligner
Radio frequency magnetron sputtering system
Dicing saw
Lapping & polishing machine
Electron beam (EB) lithography system
Focused ion beam (FIB) system
Electron cyclotron resonance (ECR) plasma etching system
Mask aligner
Radio frequency magnetron sputtering system
Dicing saw
Lapping & polishing machine
Dielectric nano-devices, Research Institute of Electrical Communication, Tohoku University | PAGE TOP |